The Forging Industry Educational and Research Foundation’s (FIERF) Board of Trustees recently completed a review and revision of the Forging Industry Technology Roadmap. It is now available at www.forging.org.

The roots of the roadmap began in in the 1990s when industry participants came together to collectively develop the industry’s vision of the future. Subsequent collaborative sessions resulted in a roadmap to move the industry toward that vision. The roadmap has been updated and revised over the years to remain timely to industry’s needs and serve as a living document for university and research interested in partnering with the North American forging industry.

The roadmap frames discussions in four strategic areas:

  • Operational Excellence – What do we currently do, and how could we do it better?
  • Capability Development – What do we currently know, and what else could we know in the future?
  • Collaborative Partnerships – What could we do together?
  • Product & Market Innovation – How well do we serve our customers, how might we serve them better and who else can we serve?

The roadmap is the lens through which the FIA Technical Committee reviews grant requests solicited by the Forging Foundation to further technology development for the betterment of the North American forging industry. The committee considers how proposed projects address the challenges of market, labor, technology, materials, energy, government and environmental issues. It also evaluates how proposals will improve market positioning, develop future and current workforces, advocate public-policy agendas, establish industry guidelines and best practices, enhance material options and usage, reduce energy inefficiencies and/or advance forging technology.

Members of the Technical Committee partner with and support Magnet Schools to develop industry-relevant projects to involve students and advance the science and technology of the forging process. They provide plant-tour opportunities, mentor professors and students throughout the project and often participate in the reporting about the projects at Technical Conferences and in the Technical Library section of the FIA website.

In this funding cycle, six project proposals were received:

  • “Using Post-Sintering Forging for Improvement of Mechanical Properties of Additive Manufactured Parts: Experimental Characterization,” Professor Timothy J. Cyders, Ohio University
  • “Hydraulic Press Upgrade and Experimental Investigation of Die Surface Friction,” Professor Joe Domblesky, Marquette University
  • “Forging of Magnesium Alloys for Automotive Applications,” Professor Mary Wells, University of Waterloo
  • “High Strength, High Toughness Microalloyed Steel Forgings Produced with Relaxed Forging Conditions and No Heat Treatment,” Professor Anthony J. DeArdo, University of Pittsburgh
  • “Development of a Manufacturing Process for High-Power-Density Hollow Shafts,” Professor Gracious Ngaile, North Carolina State University
  • “Effect of Varying Porosity Preforms on Flow Localization in Blended Master Ti6Al4V,” Professor Philip Nash, Illinois Institute of Technology

From discussions in the review of the Roadmap, the FIERF Board has seen the need to revisit and revise the Guidelines Tolerances for Custom Forgings, which include forging in four categories: Impression Die, Hot Upset, Rolled Ring Forgings and Specialized Precision Aluminum. These guidelines are part of the Product Design Guide for Forging, which is available at www.forging.org.

Become Involved

If you would like to be an industry partner of any of these research projects and/or would like to know more about the outreach of the Foundation to high schools or colleges, please contact the Foundation Office at 216-781-6260 or foundation@forging.org. Your tax-deductible corporate or individual gift will advance the science of forging and expand educational outreach and scholarships as you designate. The resources raised from industry are the resources available to fund research, education programs and scholarships. Every dollar you give will go directly to develop technology or outreach to students.