Ceramabond 571 is a water-based, two-part, fast-set magnesium-oxide-filled ceramic adhesive ideal for assembling and insulating ceramic and metal components used in high-temperature devices up to 3200°F (1760°C). It is a completely inorganic system containing no volatile organic compounds. It will not outgas in ultrahigh vacuum (UHV), a major advantage and requirement for semiconductor and aerospace applications. Additional uses include the attachment of temperature probes and the fabrication of heaters, igniters, gas chromatographs, mass spectrometers and oxygen analyzers.
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