Aremco-Bond™ 805 is a new high-temperature, thermally conductive epoxy system developed for bonding, potting and molding applications to 300°C (572°F). It exhibits excellent adhesion to a variety of high-temperature plastics as well as ceramic and high-expansion metals. Aremco-Bond 805 is easily machined, drilled, tapped or polished. Typical applications include the bonding of heat sinks and fins used in heat exchangers as well as producing vacuum molds, dies, drill jigs, injection molds and other high-temperature fixtures. Supplied in pre-measured pint, quart, gallon and 5-gallon containers from stock, Aremco-Bond 805 is mixed in a ratio of 10 parts resin to one part activator by weight and cures at room temperature in 24 hours with a final cure at 200°F in two hours.